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Main features
l Large area of infrared carbon fiber Pre-heating system, with the advantage of pre-heating fast and evenly and no light pollution.
l Temperature parameters protected by limits of authority, for avoiding error settings.
l Ten segments of temperature control process, suitable for all kinds of BGA Rework.
l Unlimited storage of the temperature profile, just need press one key to use the profile.
l Three K-type sensors available can realize the high precise temperature testing of each point of PCB or BGA, and PC can generate report of curves analysis automatically.
l Desoldering and soldering automatically, No need the manual adjustment
l Hot air flow can be adjustable to meet the demand of any chips
l USB Connection driver-free, PC control
l The bottom hot air lifting control available in the front panel, it is convenient to adjust at any time.
l Laser positioning available, to make the positioning faster.
Main technical parameter
| Power supply | AC 220V 50/60 Hz |
| Total power | Max 4100W |
| Top hot air heater power | 800 W |
| Bottom hot air heater power | 800 W |
| IR preheating power | 2400W |
| Hot air heating temp | 400℃（Max） |
| Bottom preheating size | 400mm×300mm |
| Max available PCB size | 395mm×375mm |
| Available chip size | 2×2mm--60×60mm |
| Dimensions | L530×W520×H620 |
| Communication | USB |
| Test temperature port | 3pcs |
| Net weight | about 27.5kg |
| Color | White |
bga rework station zm-r6000
